Keith Dixon
Atlanta, GA (USA)
Role(s):
C-Level Executive (CEO, CFO, etc.)
TIEMAC Corp
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Startup
Location:
Atlanta
Industry:
Transportation
Year Founded:
2013
Number Employees:
1-10 people
Business Stage:
Creation/Idea
Entity Type:
"C" Corporation
Description:
TIEMAC Corporation is developing an embedded connected device, a real time operational and back office based SaaS mobile centric solution with OSIsoft, Intel, Verizon/AT&T, ESRI and others. Through a special development and manufacturing contract we have with our Chinese partner HUAYU, we have recently decided to use Intel’s x86 Bay Trail platform chipset, which will enhance Intel’s position with our partner and TIEMAC. Our Chinese partner HUAYU is an OEM equipment manufacturing Internet of things devices, tablets and smartphones and currently sells approximately Six (6) million units of tablets and smartphones in Asia, Africa and the Middle East. Their products are all ARM (Android based). TIEMAC’s agreement is that we will bring Intel and Microsoft’s technology platform allowing them to develop and manufacture their line of products on WINTEL’s technology. We are now working to bring Intel’s Bay Trail platform to HUAYU. We have had several discussions with Intel’s Karim Isa and David McMillan, and HUAYU’s manufacturing plant was visited by Shinny Liu and Wang Xiewei from Intel/Comtech in China a few days ago. So the plan is to develop and manufacture embedded devices, tablets and smartphones, using Intel chipset. Additionally, OSIsoft is hoping to use our Advanced Telematics, real time operational and back office administration cloud based SaaS mobile centric solution to upsell to their existing customer base for usage in their fleet management. Our biggest obstacle is funding, we have achieved a great deal which includes a working prototype that we displayed at the recent OSISOFT conference held in California. Our goal is to take advantage of the China Technology Fund that Intel has just announced.
On the technical support side we need to get HUAYU, Intel and Microsoft to get three versions of Microsoft OS on Intel’s architecture for the following form factors:
1. Embedded Connected Device - Windows 8.1 Embedded Enterprise
2. Tablet – Windows 8.1
3. Smartphone – Windows Phone 8.1